Our knowledge is defined by years of experience in the area of the semiconductor industry and its specific production processes.
We supply reputable manufacturers with our components and systems.
From individual systems up to complete plants and lines for production.
(LED/FlipChip/Die Attach/RFID/Foilhandling/Printed & Flex Electronics, Roll to Roll)
- Line integration (circuit board level, reel to reel procedure)
- Special placement machinery with a process area of 2,000 mm
- Special equipment for placement machinery (Transport systems, Test systems)
- Hardening lines (radiant heat or infrared)
- Curing equipment
- Wafer feeder equipment
- Feeder systems
- Placement technologies for Die Bonding
- AOI systems